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Summary: A discrete power device product engineer with certain work experience, responsible for the development of new discrete devices (such as SiC、GaN、SGT、SJ etc.), covering from target specification setting to large-scale production stage. The job responsibilities include testing plan design, product characterization verification and reliability assessment, improvement of product yield, resolution of various production related issues, and continuous quality improvement. 具備一定工作經(jīng)驗(yàn)的分立功率器件產(chǎn)品工程師，負(fù)責(zé)分立器件（SiC、GaN、SGT、SJ等）新產(chǎn)品的開發(fā)工作，涵蓋從目標(biāo)規(guī)格設(shè)定到大規(guī)模量產(chǎn)階段。工作內(nèi)容包括測(cè)試計(jì)劃設(shè)計(jì)、產(chǎn)品特性化驗(yàn)證和可靠性鑒定、產(chǎn)品良率的提升、生產(chǎn)相關(guān)的各類問題的解決以及持續(xù)的質(zhì)量改進(jìn)。 RESPONSIBILITIES: 1. Co-work with device design engineer, marketing engineer to finish device requirement analysis, competitor analysis, construction analysis, build up the product development target and plan. Product types include and not limited to SiC, GaN, SGT, SJ etc. 與器件設(shè)計(jì)工程師, 市場(chǎng)工程師共同完成器件設(shè)計(jì)需求分析、競(jìng)爭(zhēng)對(duì)手分析、結(jié)構(gòu)分析等，制定產(chǎn)品開發(fā)目標(biāo)和計(jì)劃。產(chǎn)品類型包括但不限于SiC、GaN、SGT、SJ等。 2. Collaborate with testing engineers to develop device testing plans and schemes, and complete testing verification.協(xié)同測(cè)試工程師制定器件測(cè)試計(jì)劃和測(cè)試方案，完成測(cè)試驗(yàn)證。 3. Responsible for following up on the fab and packaging of new products throughout the process, and analyzing, identifying, and addressing various issues during the product preparation process. 負(fù)責(zé)全程跟進(jìn)新產(chǎn)品的流片、封裝，并分析、識(shí)別、處理產(chǎn)品制備過(guò)程中的各類問題。 4. Support product characterization, collaborate with design, application engineer to write the datasheet specifications. 完成產(chǎn)品特性驗(yàn)證，與設(shè)計(jì)、應(yīng)用工程師合作編寫數(shù)據(jù)表規(guī)范。 5. Complete product reliability testing and continuously promote product yield improvement.完成產(chǎn)品的可靠性測(cè)試并持續(xù)推進(jìn)產(chǎn)品的良率改善。 6. Collaborate with internal team for engineering sample support and delivery. 協(xié)同內(nèi)部團(tuán)隊(duì)，確保工程樣品的按時(shí)交付； 7. Engage in solving all issues meet internal or external to improve the product quality across the product lifetime. 介入解決產(chǎn)品生命周期中面臨的各種內(nèi)部或外部問題，以提升產(chǎn)品質(zhì)量； 8. Support on products subcon (fab/bumping/assembly/test etc.) transfer. 參與產(chǎn)品外包工廠(晶圓代工/凸點(diǎn)代工/封裝/測(cè)試等)的遷移。 REQUIREMENTS: 1. Master's students majoring in microelectronics and related fields, with at least two years of work experience in domestic and international power device semiconductor companies preferred. 微電子及相關(guān)專業(yè)碩士研究生，有國(guó)內(nèi)、國(guó)際功率器件半導(dǎo)體大廠工作兩年以上經(jīng)歷者優(yōu)先。 2. NPI experience of SiC, GaN, SGT MOS etc. products development is specially preferred. 有SiC、GaN、SGT MOS等產(chǎn)品開發(fā)NPI經(jīng)驗(yàn)者尤佳。 3. Familiar with discrete power device product characterization and qualification (ESD/LU/HTRB/HTGB/H3TRB/IOL etc.). 熟悉分立功率器件的特性化驗(yàn)證和可靠性鑒定(ESD/LU/HTRB/HTGB/H3TRB/IOL etc.). 4. Strong experience in managing R