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Packaging Engineer
面議 成都 應(yīng)屆畢業(yè)生 學(xué)歷不限
  • 全勤獎
  • 節(jié)日福利
  • 不加班
  • 周末雙休
成都芯源系統(tǒng)有限公司 2026-03-09 05:01:45 1309人關(guān)注
職位描述
該職位還未進(jìn)行加V認(rèn)證,請仔細(xì)了解后再進(jìn)行投遞!
The Day-to-Day
- Design, develop and scale to volume production of high voltage/high power packages and modules for the industrial, automotive, renewable and telecom markets.
- The candidate can understand system requirements and build these into the definition of the package to meet electrical, thermal, and mechanical specifications.
- The candidate can identify prototype/subcon partners, assess manufacturing capabilities and drive completion of 1st article builds.
- The candidate can be capable of developing new process flows/technologies necessary for building prototypes.
- The candidate can outline the package reliability plans, complete testing, summarize failure modes and identify fixes via or design and material selection.
- The candidate must have a broad knowledge of the package materials (molding compound, die attach, substrate etc) for high voltage/high power packages and modules.
Minimum Qualifications:
- BS or MS degree in Mechanical, Material Science, Electrical Engineering or related engineering degree
- 3 year of experience in design of high voltage/high power packages and modules across MOSFET, IGBT, SiC, GaN technologies.
- Proficiency in CAD software, SolidWorks / Auto CAD preferred.
- Knowledge in various packaging technology, process flow, material, qualification and manufacturing implementation.
- Knowledge in high voltage/high power package reliability requirements, failure analysis techniques, assembly process issues, etc.
- Therlectrical, stress simulation skills are a plus.
- Strong communication, presentation, and interpersonal skills.
- Problem-solving mindset.
聯(lián)系方式
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工作地點(diǎn)
地址:成都郫都區(qū)郫都區(qū)成都高新綜合保稅區(qū)B區(qū)
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